Dima roll forming line for the production of Hibond 55 profiles - for vinyl flooring. The Hibond 55 is a 55 mm deep trapezoidal floor profile used as a lightweight flooring solution.
Thickness range : 0.75 > 1.5 mm
Maximum panel width : 1200 mm
Roll forming line:
- 13 + 10 stands
- diameter: 100 mm
- center-to-center distance between rollers: 180 > 350 mm
Hi-Bond 55 = a light, fast, and compact flooring solution.
- Up to ±30–40% thinner than a traditional solid concrete floor for decorative spans.
- Lower dead weight → lighter load-bearing structure and potentially smaller foundations.
- No traditional formwork → less labor and faster assembly.
- The steel plate is simultaneously a component of the load-bearing floor.
- Ideal for steel structures, offices, renovation, extensions, homes, and industrial buildings.
- Composite profiles are available for spans of ±5–6 m.
- In short: less weight, less formwork, fast assembly, and a slim floor — with a competitive total price.